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AMD Commits to Using the Most Advanced Process for Each Generation, Continues Innovations in Design, Packaging, and Assembly Across All Products

AMD, a leader in the semiconductor industry, announced at Computex 2024 its commitment to adopting the most advanced process technologies for each new product generation while continuing to implement innovative design technologies. This commitment was reaffirmed by AMD’s Executive Vice President, Forrest Norrod, who emphasized that adopting TSMC’s 4nm and 3nm nodes for the Zen 5 architecture is crucial for maintaining high performance and efficiency.

AMD has achieved significant milestones in the data center and client segments by adopting the latest process technologies and design techniques. The Zen architecture, introduced seven years ago, has revolutionized the market, propelling AMD to new heights. At Computex 2024, AMD unveiled details of Zen 5, which will use TSMC’s new nodes to ensure high performance. Norrod, in an interview with The Next Platform, praised Intel’s aggressive plan, recognizing the importance of competing with products that excel in technology and design.

Norrod discussed the process and design technologies that AMD is using to stay ahead of the competition. He highlighted how AMD made chiplets mainstream, bringing to market the MI300A CPU-GPU combination, a significant advancement over Intel’s initial plans, which were later canceled. Additionally, AMD continues to innovate with the Infinity Fabric, an advanced interconnect solution, and introduced HBM (High Bandwidth Memory) as a standard technology for data centers.

Timothy Prickett Morgan of The Next Platform raised questions about the competition between AMD and Intel, particularly regarding Intel’s new Xeon processors and AMD’s Epyc line. Norrod reaffirmed the confidence in TSMC as a strategic partner, emphasizing AMD’s commitment to using the most advanced processes and continuing to innovate in design and assembly across all products.

The company is set to launch its first Zen 5 products next month, with Strix Point "Ryzen AI 300" and Granite Ridge "Ryzen 9000" CPUs hitting the market in July, followed by the fifth-generation Epyc Turin CPUs in Q3 2024. Currently, AMD’s Epyc CPU shipments have surpassed 30% of the market, with further growth expected thanks to the new product lineup.

AMD continues to focus on innovation to maintain its leadership position. The upcoming Ryzen 9000 (X3D) CPUs will integrate new 3D V-Cache innovations, while the next-generation Epyc CPUs will ensure superior performance for data centers. Additionally, the adoption of innovative design, assembly, and packaging technologies will strengthen AMD’s competitive position.

AMD’s innovations extend beyond data centers to consumer products. The Ryzen AI 300 and Ryzen 9000 series represent the company’s commitment to delivering high performance even in consumer devices, while 3D V-Cache technology promises to further enhance efficiency and computing capabilities.

Highlights

• Adoption of TSMC’s most advanced process nodes for each product generation.
• Continuation of innovations in design, assembly, and packaging across all products.
• Launch of Strix Point "Ryzen AI 300" and Granite Ridge "Ryzen 9000" CPUs scheduled for July 2024.
• AMD’s Epyc CPU market share surpasses 30%, with further growth anticipated.